Job Details: Job Description: The Wafer Packaging Manufacturing (WPM) SORT Test Engineering Organization in Leixlip is looking for motivated Module Process Engineer to support its operations. The engineers in this team work with worldwide and local Intel
Location: Dublin / Leixlip, Co. Kildare (Hybrid) We are seeking an experienced KYC Onboarding Analyst to join our growing team in Dublin. This role is responsible for executing the end-to-end Client Onboarding and Periodic Review lifecycle,
Location: Dublin / Leixlip, Co. Kildare (Hybrid) We are seeking an experienced Assistant Vice President level KYC Onboarding Analyst to join our growing team in Dublin. This role will be responsible for leading a small team
Location: Leixlip Oak Lawn Shift pattern : Monday to Saturday - 1hr, cleaning done after 9.30pm or before 8.30am, - 1hr before 8.30am and 1hr after 9.30pm 5hrs a week. Hourly Rate: €14.80 About Mitie :